Invention Grant
- Patent Title: Method and system for providing an energy assisted magnetic recording head in a wafer packaging configuration
- Patent Title (中): 在晶片封装结构中提供能量辅助磁记录头的方法和系统
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Application No.: US12645498Application Date: 2009-12-23
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Publication No.: US08134794B1Publication Date: 2012-03-13
- Inventor: Lei Wang
- Applicant: Lei Wang
- Applicant Address: US CA Fremont
- Assignee: Western Digital (Fremont), LLC
- Current Assignee: Western Digital (Fremont), LLC
- Current Assignee Address: US CA Fremont
- Main IPC: G11B5/02
- IPC: G11B5/02

Abstract:
A method and system for providing energy assisted magnetic recording (EAMR) heads are described. The heads include sliders having leading and trailing edges. An EAMR transducer for each head is fabricated on a front face of a substrate that corresponds to the trailing edge of the slider. An overcoat layer that includes transducer and laser contact(s) is provided on the transducer. A laser for providing light to the transducer is provided on each slider. The laser is electrically coupled to the laser contact(s) and electrically insulated from at least part of the transducer contacts. The laser is enclosed in a capping layer, which has a laser-facing surface including a laser cavity, via(s), a trailing surface, and pads on the trailing surface. The laser cavity encloses the laser between the overcoat and capping layers. The via(s) provide electrical connection to the transducer contacts. The substrate is separated into the heads.
Information query
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