Invention Grant
US08134813B2 Method and apparatus to reduce footprint of ESD protection within an integrated circuit
有权
降低集成电路内ESD保护占地面积的方法和装置
- Patent Title: Method and apparatus to reduce footprint of ESD protection within an integrated circuit
- Patent Title (中): 降低集成电路内ESD保护占地面积的方法和装置
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Application No.: US12362471Application Date: 2009-01-29
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Publication No.: US08134813B2Publication Date: 2012-03-13
- Inventor: James Karp , Richard C. Li , Fu-Hing Ho , Mohammed Fakhruddin
- Applicant: James Karp , Richard C. Li , Fu-Hing Ho , Mohammed Fakhruddin
- Applicant Address: US CA San Jose
- Assignee: Xilinx, Inc.
- Current Assignee: Xilinx, Inc.
- Current Assignee Address: US CA San Jose
- Agent Scott Hewett; John J. King
- Main IPC: H02H9/00
- IPC: H02H9/00

Abstract:
An input/output (“I/O”) circuit has a first N-channel metal-oxide semiconductor (“NMOS”) field-effect transistor (“FET”) coupled to the input pin with a silicide block. A first P-channel metal-oxide semiconductor (“PMOS”) FET is directly connected to the input pin, with its N-well electrically coupled to an ESD well bias circuit. An NMOS low-voltage differential signal (“LVDS”) driver is also directly connected to the input pin, and has cascaded NMOS FETs. The first NMOS FET of the LVDS driver is fabricated within a first P-tap guard ring electrically coupled to ground and an N-well guard ring coupled to the ESD well bias. The second NMOS FET of the LVDS driver is fabricated within a second P-tap guard ring electrically coupled to ground.
Public/Granted literature
- US20100188787A1 METHOD AND APPARATUS TO REDUCE FOOTPRINT OF ESD PROTECTION WITHIN AN INTEGRATED CIRCUIT Public/Granted day:2010-07-29
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