Invention Grant
- Patent Title: Solid electrolytic capacitor having thermal compensation
- Patent Title (中): 具有热补偿的固体电解电容器
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Application No.: US12275426Application Date: 2008-11-21
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Publication No.: US08134827B2Publication Date: 2012-03-13
- Inventor: Takashi Umemoto , Hiroshi Nonoue
- Applicant: Takashi Umemoto , Hiroshi Nonoue
- Applicant Address: JP Moriguchi
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Moriguchi
- Agency: MOTS Law, PLLC
- Agent Marvin A. Motsenbocker
- Priority: JP2007-304155 20071126
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G9/10 ; H01G9/00 ; H05K5/03

Abstract:
An aspect of the present invention provides a solid electrolytic capacitor that comprises: an anode mainly formed of a valve metal or an alloy thereof; an anode lead terminal a part of which is buried in a side surface of the anode; a dielectric layer formed on surfaces of the anode and mainly formed of an oxide; a conducting polymer layer formed on the dielectric layer; a cathode layer formed on the conducting polymer layer on an outer circumferential surface of the anode, the cathode layer comprising: a carbon layer; and a silver paste layer formed on the carbon layer; a thermal expansion layer provided on the side surface of the anode and on a part of the outer circumferential surface continuing from the side surface; and a rein outer package provided to cover the anode, dielectric layer, cathode layer, and thermal expansion layer, wherein a thermal expansion coefficient in a temperature range lower than a glass transition temperature of the thermal expansion layer is larger than that of each of the silver paste layer and the resin outer package.
Public/Granted literature
- US20090135550A1 SOLID ELECTROLYTIC CAPACITOR Public/Granted day:2009-05-28
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