A clamp-type heat sink for a memory includes two heat conducting modules, a pivot shaft, and an elastic element. The heat conducting module includes an isothermal vapor chamber plate and a heat dissipating body coupled to the isothermal vapor chamber plate. The heat dissipating body includes a base plate and heat dissipating fins extended from the base plate. The base plate includes a shaft hole for passing the pivot shaft, such that each heat dissipating body is installed serially, and the elastic element is sheathed onto the pivot shaft and includes two elastic arms extended from the elastic element and abutted against each heat dissipating body, such that each isothermal vapor chamber plate is clamped and attached onto an external side of the memory to improve the convenience and integrity of the assembling and removal process to achieve a quick assembling or removal effect and prevent the components from missing.