Invention Grant
- Patent Title: Semiconductor device including an anti-fuse element
- Patent Title (中): 包括反熔丝元件的半导体器件
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Application No.: US12621167Application Date: 2009-11-18
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Publication No.: US08134882B2Publication Date: 2012-03-13
- Inventor: Chiaki Dono
- Applicant: Chiaki Dono
- Applicant Address: JP Tokyo
- Assignee: Epida Memory, Inc.
- Current Assignee: Epida Memory, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Morrison & Foerster LLP
- Priority: JP2008-295958 20081119
- Main IPC: G11C17/18
- IPC: G11C17/18

Abstract:
A semiconductor device includes a first high potential power supply, a second low potential power supply, a third power supply having a potential higher than the first, a fourth power supply having a potential more negative than the second, and an anti-fuse element having a node at each end, one of which is connected to the fourth power supply. A driver transistor has a source connected to the third power supply, a gate connected to a control node and a drain connected to one end of the anti-fuse element. A decoding circuit includes a load transistor connected between the third power supply and the control node and at least one selection transistor connected between the second power supply and the control node. A decision circuit is connected to the first and second power supplies. The decision circuit decides the resistance value of the anti-fuse element. The anti-fuse element is rendered electrically conductive in response to activation of the driver transistor as selected by the decoding circuit. The decision circuit decides whether or not the anti-fuse element has been rendered electrically conductive.
Public/Granted literature
- US20100124139A1 SEMICONDUCTOR DEVICE INCLUDING AN ANTI-FUSE ELEMENT Public/Granted day:2010-05-20
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