Invention Grant
- Patent Title: Reduction in interference between components
- Patent Title (中): 减少组件之间的干扰
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Application No.: US12315502Application Date: 2008-12-02
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Publication No.: US08135433B2Publication Date: 2012-03-13
- Inventor: Per Pedersen
- Applicant: Per Pedersen
- Applicant Address: FI Espoo
- Assignee: Nokia Corporation
- Current Assignee: Nokia Corporation
- Current Assignee Address: FI Espoo
- Agency: Ware, Fressola, Van Der Sluys & Aldolphson LLP
- Agent Alfred A. Fressola
- Main IPC: H01Q1/52
- IPC: H01Q1/52 ; H01Q1/24

Abstract:
An apparatus is disclosed comprising a transducer, which transducer comprises at least one electrical connection point configured to enable an external electrical connection of the transducer. The transducer further comprises at least one decoupling coil configured to electrically decouple the transducer from the at least one electrical connection point at a frequency above an operating frequency of the transducer. Moreover, a method for assembling the described apparatus is disclosed.
Public/Granted literature
- US20100137019A1 Reduction in interference between components Public/Granted day:2010-06-03
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