Invention Grant
US08136017B2 Multi-layer semiconductor memory device comprising error checking and correction (ECC) engine and related ECC method
有权
多层半导体存储器件包括纠错(ECC)引擎和相关的ECC方法
- Patent Title: Multi-layer semiconductor memory device comprising error checking and correction (ECC) engine and related ECC method
- Patent Title (中): 多层半导体存储器件包括纠错(ECC)引擎和相关的ECC方法
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Application No.: US12036414Application Date: 2008-02-25
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Publication No.: US08136017B2Publication Date: 2012-03-13
- Inventor: Hyung-rok Oh , Sang-beom Kang , Woo-yeong Cho , Joon-min Park
- Applicant: Hyung-rok Oh , Sang-beom Kang , Woo-yeong Cho , Joon-min Park
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2007-0021171 20070302
- Main IPC: G11C29/00
- IPC: G11C29/00

Abstract:
Embodiments of the invention provide a multi-layer semiconductor memory device and a related error checking and correction (ECC) method. The multi-layer semiconductor memory device includes first and second memory cell array layers, wherein the first memory cell array layer stores first payload data. The multi-layer semiconductor memory device also includes an ECC engine selectively connected to the second memory cell array layer and configured to receive the first payload data, generate first parity data corresponding to the first payload data, and store the first parity data exclusively in the second memory cell array layer.
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