Invention Grant
US08136057B2 Semiconductor device manufacturing method, data generating apparatus, data generating method and recording medium readable by computer recorded with data generating program 有权
半导体器件制造方法,数据生成装置,数据生成方法以及由数据生成程序记录的计算机可读取的记录介质

  • Patent Title: Semiconductor device manufacturing method, data generating apparatus, data generating method and recording medium readable by computer recorded with data generating program
  • Patent Title (中): 半导体器件制造方法,数据生成装置,数据生成方法以及由数据生成程序记录的计算机可读取的记录介质
  • Application No.: US13223782
    Application Date: 2011-09-01
  • Publication No.: US08136057B2
    Publication Date: 2012-03-13
  • Inventor: Hiromi Hoshino
  • Applicant: Hiromi Hoshino
  • Applicant Address: JP Yokohama
  • Assignee: Fujitsu Semiconductor Limited
  • Current Assignee: Fujitsu Semiconductor Limited
  • Current Assignee Address: JP Yokohama
  • Agency: Fujitsu Patent Center
  • Priority: JP2006-229901 20060825
  • Main IPC: G06F17/50
  • IPC: G06F17/50
Semiconductor device manufacturing method, data generating apparatus, data generating method and recording medium readable by computer recorded with data generating program
Abstract:
A semiconductor manufacturing method comprising, a data generating process including, acquiring a simulation light pattern that simulates a shape of a light exposure pattern formed on a substrate on the basis of design data of a semiconductor device, acquiring a simulation electron beam exposure pattern that simulates a shape of an electron beam exposure pattern formed by an electron beam exposure on the substrate on the basis of the design data, extracting difference information representing a shape difference portion between the simulation light pattern and the simulation electron beam exposure pattern, acquiring changed design data for modifying shape by changing the design data in accordance with the difference information, conducting the electron beam exposure on the substrate by use of the changed design data for modifying the shape.
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