Invention Grant
- Patent Title: Three dimensional integrated circuits and methods of fabrication
- Patent Title (中): 三维集成电路和制造方法
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Application No.: US12283443Application Date: 2008-09-12
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Publication No.: US08136071B2Publication Date: 2012-03-13
- Inventor: Neal Solomon
- Applicant: Neal Solomon
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H03K19/173 ; H03K19/00 ; H01L25/00 ; H01L23/52 ; H01L21/70 ; H01L23/58
Abstract:
The invention relates to multi-planar logic components in a three-dimensional (3D) integrated circuit (IC) apparatus configuration. A multi-planar integrated circuit connected by through silicon vias is configured to connect microprocessor, FPGA and memory components. The integrated circuit components may be on tiles of layers of the 3D IC.
Public/Granted literature
- US20090070727A1 Three dimensional integrated circuits and methods of fabrication Public/Granted day:2009-03-12
Information query
