Invention Grant
- Patent Title: Micromechanical sensor, sensor array and method
- Patent Title (中): 微机械传感器,传感器阵列及方法
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Application No.: US11988417Application Date: 2006-07-04
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Publication No.: US08136403B2Publication Date: 2012-03-20
- Inventor: Heikki Seppa , Kirsi Tappura , Jussi Tuppurainen , Tomi Mattila , Ari Alastalo , Hannu Helle , Aarne Oja
- Applicant: Heikki Seppa , Kirsi Tappura , Jussi Tuppurainen , Tomi Mattila , Ari Alastalo , Hannu Helle , Aarne Oja
- Applicant Address: FI Espoo
- Assignee: Valtion Teknillinen Tutkimuskeskus
- Current Assignee: Valtion Teknillinen Tutkimuskeskus
- Current Assignee Address: FI Espoo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: FI20050739 20050708
- International Application: PCT/FI2006/000240 WO 20060704
- International Announcement: WO2007/006843 WO 20070118
- Main IPC: G01N29/02
- IPC: G01N29/02

Abstract:
The present invention relates to a micromechanical sensor for analyzing liquid samples and an array of such sensors. The invention also concerns a method for sensing liquid samples and the use of longitudinal bulk acoustic waves for analyzing liquid phase samples micromechanically. The sensor comprises a body and a planar wave guide portion spaced from the body. At least one electro-mechanical transducer element are used for excitation of longitudinal bulk acoustic waves to the wave guide portion in response to electrical actuation and for converting acoustic waves into electrical signals. The wave guide portion is provided with a sample-receiving zone onto which the sample can be introduced. By means of the invention, the sensitivity of micromechanical liquid sensors can be improved.
Public/Granted literature
- US20090277271A1 Micromechanical Sensor, Sensor Array and Method Public/Granted day:2009-11-12
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