Invention Grant
- Patent Title: Socket, method for manufacturing socket, and semiconductor device
- Patent Title (中): 插座,插座制造方法和半导体器件
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Application No.: US12304680Application Date: 2007-06-07
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Publication No.: US08137113B2Publication Date: 2012-03-20
- Inventor: Yasuhiro Ouchi , Shinichi Nikaido , Haruo Miyazawa
- Applicant: Yasuhiro Ouchi , Shinichi Nikaido , Haruo Miyazawa
- Applicant Address: JP Tokyo
- Assignee: Fujikura Ltd.
- Current Assignee: Fujikura Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2006-162692 20060612; JP2007-105724 20070413
- International Application: PCT/JP2007/061539 WO 20070607
- International Announcement: WO2007/145128 WO 20071221
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A socket includes an insulating elastomeric sheet having a penetration hole, metal circuits formed on at least one of the front and rear surfaces of the elastomeric sheet, and a through-hole having a metal film formed on an inner wall of the penetration hole. The metal circuit on the front surface of the elastomeric sheet is electrically connected to the metal circuit on the rear surface of the elastomeric sheet via the through-hole. With such a configuration of the socket, it is possible to provide a socket contact terminal and a semiconductor device having the same, which is suitable for low-resistance, large-current, and high-speed configurations.
Public/Granted literature
- US20090197437A1 SOCKET, METHOD FOR MANUFACTURING SOCKET, AND SEMICONDUCTOR DEVICE Public/Granted day:2009-08-06
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