Invention Grant
- Patent Title: Flexible, low dielectric loss composition and method for preparing the same
- Patent Title (中): 柔性，低介电损耗组成及其制备方法
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Application No.: US12344484Application Date: 2008-12-27
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Publication No.: US08138263B2Publication Date: 2012-03-20
- Inventor: Shur-Fen Liu , Meng-Huei Chen , Man-Chun Yu
- Applicant: Shur-Fen Liu , Meng-Huei Chen , Man-Chun Yu
- Applicant Address: TW Hsinchu County
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu County
- Agency: Pai Patent & Trademark Law Firm
- Agent Chao-Chang David Pai
- Priority: TW96150772A 20071228
- Main IPC: C08K3/22
- IPC: C08K3/22 ; C08L101/00 ; H01B3/30
Abstract:
A flexible, low dielectric loss composition, used to fabricate a flexible substrate, is provided. The composition includes: SrTiO3 and/or Ba(Sr)TiO3 ceramic particle, with a particular size between 30 nm and 2 μm, in an amount of 20-80% by weight of the composition; at least one flexile macromolecule in an amount of 1.0-50% by weight of the composition, wherein the macromolecules have functional groups of hydroxyl group, carboxyl group, allyl group, amino group, or chain aliphatic epoxy group; and a thermosetting organic resin.
Public/Granted literature
- US20090170993A1 FLEXIBLE, LOW DIELECTRIC LOSS COMPOSITION AND METHOD FOR PREPARING THE SAME Public/Granted day:2009-07-02
Information query
