Invention Grant
- Patent Title: Spectroscopy module, and method for manufacturing the same
- Patent Title (中): 光谱模块及其制造方法
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Application No.: US12465264Application Date: 2009-05-13
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Publication No.: US08139214B2Publication Date: 2012-03-20
- Inventor: Katsumi Shibayama
- Applicant: Katsumi Shibayama
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: Hamamatsu Photonics K.K.
- Current Assignee: Hamamatsu Photonics K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JPP2008-128687 20080515; JPP2008-311086 20081205
- Main IPC: G01J3/18
- IPC: G01J3/18

Abstract:
In a spectroscopy module 1, a light passing hole 5b through which a light L1 advancing to a spectroscopic portion 4 passes is formed in a light detecting element 5. Therefore, it is possible to prevent the relative positional relationship between the light passing hole 5b and a light detecting portion 5a of the light detecting element 5 from deviating. Moreover, the light to be measured L1 advancing to the spectroscopic portion 4 via the light passing hole 5b and the diffracted lights L2 advancing to the light detecting portion 5a from the spectroscopic portion 4 pass through a void formed between the light detecting element 5 and the substrate 2 by an opening portion 10a of a wiring substrate 10. Therefore, according to the spectroscopy module 1, it is possible to improve the reliability.
Public/Granted literature
- US20090284743A1 SPECTROSCOPY MODULE, AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2009-11-19
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