A multi-specification fixing module used at a motherboard and a cooler. The multi-specification fixing module includes a plurality of the fixing sheet and a specification adjusting base plate. Each of the fixing sheets has a fixing hole. The specification adjusting base plate includes a plurality of adjusting portions at a periphery of the specification adjusting base plate. Each of the adjusting portions has an adjusting guiding rail group and an adjusting portion hole. The positions of the fixing sheets are adjusted according to the size of the cooler body to install the fixing sheets in the adjusting guiding rail groups, and the installing fixing accessories are connectedly fixed at the motherboard holes via the fixing holes and the adjusting portion holes to fix and install the cooler body above the socket.