Invention Grant
- Patent Title: Printed circuit board, method for manufacturing printed circuit board and electronic apparatus
- Patent Title (中): 印刷电路板，印刷电路板和电子设备的制造方法
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Application No.: US12285352Application Date: 2008-10-02
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Publication No.: US08139372B2Publication Date: 2012-03-20
- Inventor: Yuusuke Matsui
- Applicant: Yuusuke Matsui
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2007-258823 20071002
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K7/18
Abstract:
A printed circuit board is disclosed. The printed circuit board includes an insulation layer and a conductor layer having a GND pattern. The printed circuit board has a center portion, to which an element is to be mounted. The printed circuit board has a periphery portion and a slit pattern separating the periphery portion from the center portion. The GND pattern extends through the center portion and the periphery portion.
Public/Granted literature
- US20090086450A1 Printed circuit board, method for manufacturing printed circuit board and electronic apparatus Public/Granted day:2009-04-02
Information query
