Invention Grant
- Patent Title: Electronic device having electrically connecting structure
- Patent Title (中): 具有电连接结构的电子设备
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Application No.: US12412178Application Date: 2009-03-26
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Publication No.: US08139374B2Publication Date: 2012-03-20
- Inventor: Yoshiaki Hiraoka
- Applicant: Yoshiaki Hiraoka
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: DLA Piper LLP (US)
- Priority: JP2008-085978 20080328
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
An electronic device is provided which makes it possible to reduce noise generated from a signal line around a connecting portion connecting a first body and a second body. The connecting portion has a first metallic portion. A first circuit board provided in the first body and a second circuit board provided in the second body. The signal line that electrically connects the first circuit board and the second circuit board via the connecting portion, in which the signal line is wound around the first metallic portion.
Public/Granted literature
- US20100079967A1 ELECTRONIC DEVICE HAVING ELECTRICALLY CONNECTING STRUCTURE Public/Granted day:2010-04-01
Information query
