Invention Grant
- Patent Title: Sound-permeable film, electronic component with sound-permeable film, and method of producing circuit board having electronic component mounted thereon
- Patent Title (中): 透声膜，具有透声膜的电子部件及其上安装有电子部件的电路板的制造方法
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Application No.: US11991977Application Date: 2006-09-11
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Publication No.: US08141678B2Publication Date: 2012-03-27
- Inventor: Yoshiki Ikeyama , Yuri Horie , Kouji Furuuchi
- Applicant: Yoshiki Ikeyama , Yuri Horie , Kouji Furuuchi
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2005-267647 20050914
- International Application: PCT/JP2006/317983 WO 20060911
- International Announcement: WO2007/032312 WO 20070322
- Main IPC: G10K11/00
- IPC: G10K11/00
Abstract:
A sound-permeable film (11) includes: a porous membrane (13) that contains polytetrafluoroethylene as its main component, allows sound to pass therethrough, and prevents an foreign object such as a water drop from passing therethrough; and a heat-resistant double-sided adhesive sheet (15) that is disposed on a part of at least one of main surfaces of the porous membrane (13).
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