Invention Grant
- Patent Title: Electromechanical element, electric circuit device and production method of those
- Patent Title (中): 机电元件,电路装置及其生产方法
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Application No.: US11676353Application Date: 2007-02-19
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Publication No.: US08142669B2Publication Date: 2012-03-27
- Inventor: Akira Akiba , Shun Mitarai
- Applicant: Akira Akiba , Shun Mitarai
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JPP2006-042987 20060220
- Main IPC: H01L21/302
- IPC: H01L21/302 ; B81C1/00

Abstract:
An electromechanical element includes a mechanically movable element through a hollow formed on a substrate, and a plurality of holes formed in the movable element. In the electromechanical element, the plurality of holes are arranged such that at least two holes are in a same line, at least one hole is in another line located adjacent to the one line with at least two holes, and a distance between one of the holes arranged in the same line and the other hole located at the closest position from the one of the two holes arranged in the same line is longer than a distance between the holes adjacently arranged in the same line.
Public/Granted literature
- US20080174204A1 ELECTROMECHANICAL ELEMENT, ELECTRIC CIRCUIT DEVICE AND PRODUCTION METHOD OF THOSE Public/Granted day:2008-07-24
Information query
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