Invention Grant
- Patent Title: Golden finger for flexible printed circuitboard
- Patent Title (中): 金手指柔性印刷电路板
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Application No.: US12575863Application Date: 2009-10-08
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Publication No.: US08143527B2Publication Date: 2012-03-27
- Inventor: Chin-Wen Lo , Hsueh-Chih Wu
- Applicant: Chin-Wen Lo , Hsueh-Chih Wu
- Applicant Address: TW Taichung
- Assignee: Wintek Corporation
- Current Assignee: Wintek Corporation
- Current Assignee Address: TW Taichung
- Agency: Morris Manning & Martin LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: TW97218535U 20081017
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A golden finger for flexible printed circuitboard, comprises: a frame with a tail, being composed of a stiffening plate, a bottom substrate, a bottom copper layer, a cover layer, and a top copper layer while enabling the bottom copper layer to be formed with at least one first routing and at least one second routing, and enabling the top copper layer to be formed with at least one first pin and at least one second pin; at least one first via hole, each being filled with a conductive material and disposed at a position between its corresponding first pin and first routing for connecting the first pin to the first routing electrically; and at least one second via hole, each filled with a conductive material and being disposed at a position between the its corresponding second pin and second routing for connecting the second pin to the second routing electrically.
Public/Granted literature
- US20100096165A1 GOLDEN FINGER FOR FLEXIBLE PRINTED CIRCUITBOARD Public/Granted day:2010-04-22
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