Invention Grant
- Patent Title: Wiring board having solder bump and method for manufacturing the same
- Patent Title (中): 具有焊料凸块的接线板及其制造方法
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Application No.: US12405536Application Date: 2009-03-17
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Publication No.: US08143534B2Publication Date: 2012-03-27
- Inventor: Takuya Hando , Hajime Saiki , Kazutaka Tanaka
- Applicant: Takuya Hando , Hajime Saiki , Kazutaka Tanaka
- Applicant Address: JP Nagoya
- Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee: NGK Spark Plug Co., Ltd.
- Current Assignee Address: JP Nagoya
- Agency: Stites & Harbison PLLC
- Agent Jeffrey A. Haeberlin
- Priority: JP2008-068593 20080317
- Main IPC: H05K1/11
- IPC: H05K1/11
Abstract:
A wiring board has a wiring board main body, a solder resist and solder bumps. The solder resist is formed on a top surface of the wiring board main body, and includes first openings, and second openings that have a diameter larger than that of the first openings. The solder bumps are disposed in the first openings and in the second openings. In addition, top portions of the solder bumps disposed in the first openings have a flat face, while top portions of the solder bumps disposed in the second openings have a non-flat face.
Public/Granted literature
- US20090229861A1 WIRING BOARD HAVING SOLDER BUMP AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2009-09-17
Information query
