Invention Grant
- Patent Title: Semiconductor module with micro-buffers
- Patent Title (中): 具有微缓冲器的半导体模块
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Application No.: US12523029Application Date: 2008-02-05
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Publication No.: US08143720B2Publication Date: 2012-03-27
- Inventor: Frank Lambrecht
- Applicant: Frank Lambrecht
- Applicant Address: US CA Sunnyvale
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Morgan, Lewis & Bockius LLP
- International Application: PCT/US2008/053082 WO 20080205
- International Announcement: WO2008/097997 WO 20080814
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
The semiconductor module includes a plurality of memory die on a first side of a substrate and a plurality of buffer die on a second side of the substrate. Each of the memory die is disposed opposite and electrically coupled to one of the buffer die.
Public/Granted literature
- US20100078809A1 Semiconductor Module with Micro-Buffers Public/Granted day:2010-04-01
Information query
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