Invention Grant
- Patent Title: In-mould molding touch module and method for manufacturing the same
- Patent Title (中): 模内成型触摸模块及其制造方法
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Application No.: US13085499Application Date: 2011-04-13
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Publication No.: US08143905B2Publication Date: 2012-03-27
- Inventor: Min-Yi Lee
- Applicant: Min-Yi Lee
- Applicant Address: TW Taipei
- Assignee: TPK Touch Solutions Inc.
- Current Assignee: TPK Touch Solutions Inc.
- Current Assignee Address: TW Taipei
- Agent Gokalp Bayramoglu; Anna Tsang
- Priority: TW96139593A 20071023
- Main IPC: G01R27/26
- IPC: G01R27/26

Abstract:
An in-mold molding touch module includes a plastic film, a touch circuit and a molding rind. The plastic film includes an inner surface and an outer surface for handling and touching. At least one region of the inner surface and a corresponding region of the outer surface define a touch area. The touch circuit is arranged on the inner surface in the touch area. The molding rind is integrated on the inner surface by an in-mold injecting mode to contain the touch circuit for forming a one-piece body. In addition, the invention also provides a method for manufacturing an in-mold molding touch module.
Public/Granted literature
- US20110186422A1 IN-MOULD MOLDING TOUCH MODULE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2011-08-04
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