Invention Grant
- Patent Title: High impedance electrical connection via
- Patent Title (中): 高阻抗电气连接通孔
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Application No.: US12607027Application Date: 2009-10-27
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Publication No.: US08143976B2Publication Date: 2012-03-27
- Inventor: Christopher P. Wyland
- Applicant: Christopher P. Wyland
- Applicant Address: US CA San Jose
- Assignee: Xilinx, Inc.
- Current Assignee: Xilinx, Inc.
- Current Assignee Address: US CA San Jose
- Agent LeRoy D. Maunu
- Main IPC: H01P7/08
- IPC: H01P7/08 ; H03H7/38

Abstract:
Vias for differential signals are typically of a lower impedance than the signal lines connected to them. The noise and reflected signals resulting in impedance mismatch may require circuits to be operated at a frequency far lower than desired. One or more embodiments of the present invention avoid impedance mismatch in circuits and achieve an advance in the art by providing a via with higher impedance through the addition of split ring resonators (SSRs) to each end of the via.
Public/Granted literature
- US20110095851A1 HIGH IMPEDANCE ELECTRICAL CONNECTION VIA Public/Granted day:2011-04-28
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