The present invention is a buffer device that is designed and configured to successfully and adequately buff and polish any desired surface without causing fatigue for the user, as well as without creating any swirl marks. In order to provide for such a product, the present invention comprises a frame having a cylindrical body secured thereto. A motor is coupled to the cylindrical body to provide for the body to rotate about a normally horizontal axis that is parallel to the desired surface to be buffed, polished, and cleaned or the like. Secured to the cylindrical body is a buffing/cleaning pad fabricated from a conventional material.