Invention Grant
- Patent Title: Low-profile tool-less board extraction device and method of using the same
- Patent Title (中): 低调无工具板提取装置及其使用方法
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Application No.: US12120373Application Date: 2008-05-14
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Publication No.: US08146220B2Publication Date: 2012-04-03
- Inventor: An-Sheng Anson Zheng , Michael T. Milo , Brett C. Ong
- Applicant: An-Sheng Anson Zheng , Michael T. Milo , Brett C. Ong
- Applicant Address: US CA Redwood City
- Assignee: Oracle America, Inc.
- Current Assignee: Oracle America, Inc.
- Current Assignee Address: US CA Redwood City
- Agency: Osha • Liang LLP
- Main IPC: D02J1/22
- IPC: D02J1/22
Abstract:
A board extraction device with integrated mounting includes a base portion configured to be disposed on an opening of a circuit board, a rivet extending from a surface of the base portion and configured to pass through the opening, a handle flexibly connected to the base portion, and a pin flexibly connected to the base portion. The rivet has a hole extending therethrough. The pin engages the hole so as to fix the base portion to the circuit board.
Public/Granted literature
- US20090282666A1 LOW-PROFILE TOOL-LESS BOARD EXTRACTION DEVICE WITH INTEGRATED MOUNTING, FOR CLOSE PROXIMITY APPLICATIONS Public/Granted day:2009-11-19
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