Invention Grant
- Patent Title: Method of aligning components for installation on a head suspension assembly
- Patent Title (中): 将组件对准安装在头部悬挂组件上的方法
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Application No.: US12211527Application Date: 2008-09-16
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Publication No.: US08146235B2Publication Date: 2012-04-03
- Inventor: Raymond R. Wolter
- Applicant: Raymond R. Wolter
- Applicant Address: US MN Hutchinson
- Assignee: Hutchinson Technology Incorporated
- Current Assignee: Hutchinson Technology Incorporated
- Current Assignee Address: US MN Hutchinson
- Agency: Faegre Baker Daniels LLP
- Main IPC: G11B5/127
- IPC: G11B5/127 ; H04R31/00

Abstract:
A head suspension for supporting a head slider over a storage media in a dynamic storage device is provided with a head suspension component having a spring metal layer, an electrically conductive layer and a dielectric layer interposed between the metal layer and the electrically conductive layer. A plurality of electrically conductive traces with bond pads are formed in the electrically conductive layer. A feature datum is also formed in the electrically conductive layer on a detachable carrier strip. The feature datum defines a first edge in the electrically conductive layer parallel to an edge of the bond pads.
Public/Granted literature
- US20090009910A1 METHOD OF ALIGNING COMPONENTS FOR INSTALLATION ON A HEAD SUSPENSION ASSEMBLY Public/Granted day:2009-01-08
Information query
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