Invention Grant
- Patent Title: Method and device for locating hole center
- Patent Title (中): 孔中心定位方法及装置
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Application No.: US12582923Application Date: 2009-10-21
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Publication No.: US08146262B1Publication Date: 2012-04-03
- Inventor: John F Suarez , Daniel W Campbell
- Applicant: John F Suarez , Daniel W Campbell
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Hanley, Flight & Zimmerman, LLC.
- Main IPC: G01B2/25
- IPC: G01B2/25

Abstract:
A device locates an apparatus to the center of a hole in a structure. The device includes a hub adapted to have the apparatus mounted thereon and a plurality of locator elements spaced around the hub which extend at least partially into the hole. Means coupled with the locator elements and the hub are used to displace the locator elements outwardly into engagement with the edges of the structure and to move the hub into axial alignment with the center of the hole.
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