Invention Grant
- Patent Title: Die stamping system
- Patent Title (中): 冲压系统
-
Application No.: US12189804Application Date: 2008-08-12
-
Publication No.: US08146470B2Publication Date: 2012-04-03
- Inventor: Shu-Wei Zhou , Fu-Shun Huang , Chia-Hsiang Ou
- Applicant: Shu-Wei Zhou , Fu-Shun Huang , Chia-Hsiang Ou
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200810301328 20080428
- Main IPC: B26D7/06
- IPC: B26D7/06

Abstract:
A die stamping system includes an upper die, a sliding block, a lower stripper, a die holder connected to the lower stripper, and a lower die-set moveably connected to the die holder. The sliding block includes a body with a wedge-shaped head facing down, a punch connected to the body, and two arms on opposite sides of the body, respectively. The lower stripper matches the upper die-set and has an aperture for passage of the punch therethrough. The die holder is connected to the lower stripper and includes an opening for passage of the body therethrough, and a first notch receiving the two arms. The first notch is larger than the arms. The lower die-set is movably connected to the die holder and includes a wedge-shaped padding block facing up and supporting the wedge-shaped head of the body.
Public/Granted literature
- US20090266208A1 DIE STAMPING SYSTEM Public/Granted day:2009-10-29
Information query