Invention Grant
- Patent Title: Lay-up apparatus
- Patent Title (中): 铺设装置
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Application No.: US12361333Application Date: 2009-01-28
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Publication No.: US08146643B2Publication Date: 2012-04-03
- Inventor: Masato Kasahara , Yutaka Momota
- Applicant: Masato Kasahara , Yutaka Momota
- Applicant Address: JP Tokyo
- Assignee: Nisshinbo Industries, Inc.
- Current Assignee: Nisshinbo Industries, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2008-018422 20080130
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B32B37/02 ; B32B38/00 ; B32B38/04

Abstract:
To provide a lay-up apparatus capable of precision positioning and laying of thin strips of copper foil or insulation tape on a flat plane even when there are variations in the cut lengths of the strips. A lay-up apparatus lays first and second strips of tape 101, 102 on top of two electrodes 5, 6 deposited on a photovoltaic devices panel 1. The strips of tape are unwound by first and second grippers 112, 122 and cut to predetermined lengths by first and second cutters 113, 123. The cut strips of tape are laid one on top of the other and transported by rotatable moving means 130. The moving means 130 rotates in opposite directions when laying the strips of tape it holds from the electrode 5 toward the electrode 6 and when laying the strips of tape from the electrode 6 toward the electrode 5, while using one end of the strips of tape as a reference and keeping constant the relative positions of the reference end of the strips of tape and that electrode which is nearest the reference end.
Public/Granted literature
- US20090188628A1 LAY-UP APPARATUS Public/Granted day:2009-07-30
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