Invention Grant
- Patent Title: Blister package
- Patent Title (中): 吸塑包装
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Application No.: US12618931Application Date: 2009-11-16
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Publication No.: US08146741B2Publication Date: 2012-04-03
- Inventor: Kensuke Matsuoka , Yoshihiro Iwao , Katsuhiro Okada
- Applicant: Kensuke Matsuoka , Yoshihiro Iwao , Katsuhiro Okada
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2008-293850 20081117
- Main IPC: A61B17/06
- IPC: A61B17/06
Abstract:
A blister package comprises a blister and a cover sheet, and the blister has a groove formed in an outer edge section of the blister. The outer edge section of the blister includes an outer region and an inner region, the groove is formed on the inward side of the outer region, and the inner region is formed on the inward side of the groove. The peel strength between the outer region and the cover sheet is greater than the tear strength of the cover sheet, and the peel strength between the inner region and cover sheet is smaller than the tear strength of the cover sheet.
Public/Granted literature
- US20100122927A1 BLISTER PACKAGE Public/Granted day:2010-05-20
Information query
