For producing a card-type data carrier, an electronic module is inserted into a cutout of a semifinished product having at least one film. The cutout is produced such that an interspace remains between the periphery of the module and the cutout after the module has been inserted into the cutout. After the module has been inserted into the cutout, the at least one film is locally heated and densified around the module such that the at least one film closes the interspace. The film is preferably heated by means of a stamp, in particular of a sonotrode.