Invention Grant
- Patent Title: Pipe joint cover structure and pipe connection method
- Patent Title (中): 管接头盖结构及管接法
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Application No.: US12084971Application Date: 2006-11-17
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Publication No.: US08146953B2Publication Date: 2012-04-03
- Inventor: Haruo Nakata , Hironori Iwanaga
- Applicant: Haruo Nakata , Hironori Iwanaga
- Applicant Address: JP Osaka
- Assignee: Daikin Industries, Ltd
- Current Assignee: Daikin Industries, Ltd
- Current Assignee Address: JP Osaka
- Agency: Birch, Stewart, Kolasch & Birch, LLP.
- Priority: JP2005-333302 20051117; JP2006-023472 20060131
- International Application: PCT/JP2006/322935 WO 20061117
- International Announcement: WO2007/058290 WO 20070524
- Main IPC: F16L33/00
- IPC: F16L33/00
Abstract:
To mount a partition cover (2) in a pipe joint (1), a nut (12) is screwed onto a joint body (11) to sandwich the partition cover (2) between the joint body and the nut. At this time, the partition cover is supported so as not to press a sleeve (13). As such, an opening (1a) of the pipe joint is sealed while preventing the sleeve from being deformed due to the partition cover being mounted.
Public/Granted literature
- US20090167015A1 Pipe Joint Cover Structure and Pipe Connection Method Public/Granted day:2009-07-02
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