Invention Grant
- Patent Title: Fluid ejecting apparatus
- Patent Title (中): 流体喷射装置
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Application No.: US12437653Application Date: 2009-05-08
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Publication No.: US08147030B2Publication Date: 2012-04-03
- Inventor: Koji Harada
- Applicant: Koji Harada
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2008-123224 20080509
- Main IPC: B41J2/165
- IPC: B41J2/165

Abstract:
A fluid ejecting apparatus includes an ejection head having an ejection surface with a nozzle region and a capping device that contacts the ejection surface. The capping device includes first and second contact members held by a cap body. When the first contact member contacts the ejection surface, a surface of the first contact member surrounds the nozzle region. The second contact member is formed in a closed frame-shape to be disposed outside a surface of the first contact member opposite the surface of the first contact member. The cap body includes first and second suction ports. The first suction port decompresses a first space formed between the first contact member and the ejection surface when the capping device contacts the ejection head. The second suction port decompresses a second space formed between the second contact member and the ejection surface when the capping device contacts the ejection head.
Public/Granted literature
- US20090278884A1 FLUID EJECTING APPARATUS Public/Granted day:2009-11-12
Information query
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