Invention Grant
US08147044B2 Liquid supply device, liquid ejecting apparatus, and liquid supply method 有权
液体供给装置,液体喷射装置和液体供给方法

  • Patent Title: Liquid supply device, liquid ejecting apparatus, and liquid supply method
  • Patent Title (中): 液体供给装置,液体喷射装置和液体供给方法
  • Application No.: US12331907
    Application Date: 2008-12-10
  • Publication No.: US08147044B2
    Publication Date: 2012-04-03
  • Inventor: Hideya Yokouchi
  • Applicant: Hideya Yokouchi
  • Applicant Address: JP Tokyo
  • Assignee: Seiko Epson Corporation
  • Current Assignee: Seiko Epson Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Workman Nydegger
  • Priority: JP2007-319816 20071211; JP2008-222048 20080829
  • Main IPC: B41J2/175
  • IPC: B41J2/175
Liquid supply device, liquid ejecting apparatus, and liquid supply method
Abstract:
A liquid supply device includes a liquid supply channel that supplies a liquid from an upstream side as a liquid supply source side to a downstream side, on which the liquid is consumed, a first valve that is provided in the liquid supply channel to open and close the liquid supply channel, and a second valve that is provided on a downstream side from the first valve in the liquid supply channel to open and close the liquid supply channel. The first valve is closed when the second valve is open.
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