Invention Grant
US08147573B2 Bonding structure and bonding method for cemented carbide element and diamond element, cutting tip and cutting element for drilling tool, and drilling tool
有权
硬质合金元件和金刚石元件的接合结构和接合方法，切削刀头和钻具切削元件以及钻具
- Patent Title: Bonding structure and bonding method for cemented carbide element and diamond element, cutting tip and cutting element for drilling tool, and drilling tool
- Patent Title (中): 硬质合金元件和金刚石元件的接合结构和接合方法，切削刀头和钻具切削元件以及钻具
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Application No.: US12575074Application Date: 2009-10-07
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Publication No.: US08147573B2Publication Date: 2012-04-03
- Inventor: Kazuo Yamamoto , Tadakazu Ohashi , Akhmadi Wardoyo
- Applicant: Kazuo Yamamoto , Tadakazu Ohashi , Akhmadi Wardoyo
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Materials Corporation
- Current Assignee: Mitsubishi Materials Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leason Ellis LLP.
- Priority: JP2002-217433 20020726; JP2003-088130 20030327; JP2003-088131 20030327; JP2003-088132 20030327
- Main IPC: B24D3/00
- IPC: B24D3/00 ; B24D11/00 ; B24D18/00 ; B24D3/02 ; C09K3/14 ; C09C1/68
Abstract:
A cutting tip for a drilling tool includes a cemented carbide cutting base, a diamond element supported by the cutting base, and a bonding layer formed between the cutting base and the diamond element in order to bond them. The bonding layer includes diffusion layers and in which one or two or more metals selected from a group consisting of Fe, Ni, Co, Ti, Zr, W, V, Nb, Ta, Cr, Mo, and Hf diffuses into at least one of the diamond or the cement carbide.
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