Invention Grant
- Patent Title: Latent curing agent
- Patent Title (中): 潜在固化剂
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Application No.: US12223869Application Date: 2007-12-27
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Publication No.: US08147720B2Publication Date: 2012-04-03
- Inventor: Katsuhiko Komuro , Masahiko Ito , Daisuke Masuko
- Applicant: Katsuhiko Komuro , Masahiko Ito , Daisuke Masuko
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Corporation,Sony Chemical & Information Device Corporation
- Current Assignee: Sony Corporation,Sony Chemical & Information Device Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-014187 20070124
- International Application: PCT/JP2007/075136 WO 20071227
- International Announcement: WO2008/090719 WO 20080731
- Main IPC: H01B1/00
- IPC: H01B1/00

Abstract:
An aluminum chelate-based latent curing agent is provided which can cure a thermosetting epoxy resin at a relatively low temperature in a short period of time. A method for producing such an aluminum chelate-based latent curing agent, whose curing conditions can be relatively easily controlled, is also provided. The aluminum chelate-based latent curing agent is made latent by reacting a silsesquioxane-type oxetane derivative with an aluminum chelating agent in the presence of an alicyclic epoxy compound.
Public/Granted literature
- US20090152504A1 Latent Curing Agent Public/Granted day:2009-06-18
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