Invention Grant
- Patent Title: Lithography processes using phase change compositions
- Patent Title (中): 使用相变组合物进行平版印刷
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Application No.: US11661028Application Date: 2005-09-23
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Publication No.: US08147742B2Publication Date: 2012-04-03
- Inventor: Wei Chen , Brian Robert Harkness , Joan Sudbury-Holtschlag , Lenin James Petroff
- Applicant: Wei Chen , Brian Robert Harkness , Joan Sudbury-Holtschlag , Lenin James Petroff
- Applicant Address: US MI Midland
- Assignee: Dow Corning Corporation
- Current Assignee: Dow Corning Corporation
- Current Assignee Address: US MI Midland
- Agent Erika Takeuchi
- International Application: PCT/US2005/034044 WO 20050923
- International Announcement: WO2006/041645 WO 20060420
- Main IPC: B29C33/70
- IPC: B29C33/70
Abstract:
A lithography method includes the steps of: A) filling a mold having a patterned surface with a phase change composition at a temperature above the phase change temperature of the phase change composition; B) hardening the phase change composition to form a patterned feature; C) separating the mold and the patterned feature; optionally D) etching the patterned feature; optionally E) cleaning the mold; and optionally F) repeating steps A) to D) reusing the mold. The PCC may include an organofunctional silicone wax.
Public/Granted literature
- US20070290387A1 Lithography Processes Using Phase Change Compositions Public/Granted day:2007-12-20
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