Invention Grant
- Patent Title: Gold alloy wire for ball bonding
- Patent Title (中): 用于球接的金合金丝
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Application No.: US12224212Application Date: 2008-06-23
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Publication No.: US08147750B2Publication Date: 2012-04-03
- Inventor: Mitsuo Takada , Satoshi Teshima , Takeshi Kuwahara
- Applicant: Mitsuo Takada , Satoshi Teshima , Takeshi Kuwahara
- Applicant Address: JP Tokyo
- Assignee: Tanaka Denshi Kogyo KK
- Current Assignee: Tanaka Denshi Kogyo KK
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2007-276104 20071024
- International Application: PCT/JP2008/061424 WO 20080623
- International Announcement: WO2009/054164 WO 20090430
- Main IPC: C22C5/02
- IPC: C22C5/02 ; B22D3/00 ; B22D5/00 ; H01F1/16 ; H02G3/04
Abstract:
There is provided a gold alloy wire for a ball bonding. The gold alloy consists of 10 to 50 ppm by mass of magnesium (Mg); 5 to 20 ppm by mass of europium (Eu); 2 to 9 ppm by mass of calcium (Ca); and a remaining portion being gold (Au) having a purity of a minimum of 99.998% by mass. In the gold alloy wire for a ball bonding, an addition amount of calcium (Ca) is a maximum of half that of europium (Eu).
Public/Granted literature
- US20100226816A1 GOLD ALLOY WIRE FOR BALL BONDING Public/Granted day:2010-09-09
Information query
