Invention Grant
- Patent Title: Micro passage chip and fluid transferring method
- Patent Title (中): 微通道芯片和流体转移方法
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Application No.: US12307403Application Date: 2007-07-04
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Publication No.: US08147774B2Publication Date: 2012-04-03
- Inventor: Hisashi Hagiwara , Yoshinori Mishina
- Applicant: Hisashi Hagiwara , Yoshinori Mishina
- Applicant Address: JP Sagamihara-Shi
- Assignee: Aida Engineering, Ltd.
- Current Assignee: Aida Engineering, Ltd.
- Current Assignee Address: JP Sagamihara-Shi
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-185537 20060705
- International Application: PCT/JP2007/063354 WO 20070704
- International Announcement: WO2008/004572 WO 20080110
- Main IPC: B01L3/00
- IPC: B01L3/00 ; B32B3/00 ; F16K17/40 ; F16K3/00 ; F17D1/00 ; G01N33/00 ; F17D1/16 ; G01L27/00 ; G01F19/00

Abstract:
There is provided by the present invention a novel micro passage chip having such a structure that a fluid can be transferred without using a physical or mechanical squeezing means that is applied from above the substrate of the micro passage chip. The micro passage chip of the present invention comprises at least a first substrate, a second substrate, and an intermediate substrate interposed between the first substrate and the second substrate and is characterized in that a first non-adhesive thin-film layer is formed on at least one of the mating sides of the first substrate and the intermediate substrate and at least one port for fluids that is in contact with the first non-adhesive thin-film layer and which is open to the outer surface of the first substrate is provided in any position on the first non-adhesive thin-film layer, and that at least a portion of a second non-adhesive thin-film layer whose length is either the same as or different from that of the first non-adhesive thin-film layer is formed on at least one of the mating sides of the second substrate and the intermediate substrate such that it lies either above or under the first non-adhesive thin-film layer, with the intermediate substrate lying in between, and a pressurizing port that is in contact with the second non-adhesive thin-film layer and which is open to the outer surface of the first or the second substrate is provided in at least one area on the second non-adhesive thin-film layer.
Public/Granted literature
- US20090202391A1 MICRO PASSAGE CHIP AND FLUID TRANSFERRING METHOD Public/Granted day:2009-08-13
Information query
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