Invention Grant
- Patent Title: Antimicrobial implant
- Patent Title (中): 抗菌植入物
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Application No.: US11504307Application Date: 2006-08-15
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Publication No.: US08147861B2Publication Date: 2012-04-03
- Inventor: Eric Jones , Aiguo Wang
- Applicant: Eric Jones , Aiguo Wang
- Applicant Address: US NJ Manwah
- Assignee: Howmedica Osteonics Corp.
- Current Assignee: Howmedica Osteonics Corp.
- Current Assignee Address: US NJ Manwah
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: A61L33/00
- IPC: A61L33/00 ; A61F2/02 ; A61K33/38
Abstract:
A method of building an orthopedic implant including the steps of mixing a powder having antimicrobial properties with a biocompatible powder to form a mixture. Next, the mixture is deposited on top of a substrate. The substrate may be part of the finished product or only a work platform. The mixture layer is then selectively melted.
Public/Granted literature
- US20080050412A1 Antimicrobial implant Public/Granted day:2008-02-28
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