Invention Grant
- Patent Title: Metal clad laminate and method for manufacturing metal clad laminate
- Patent Title (中): 金属复合层压板及其制造方法
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Application No.: US12556143Application Date: 2009-09-09
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Publication No.: US08147904B2Publication Date: 2012-04-03
- Inventor: Satoru Zama , Kenichi Ohga
- Applicant: Satoru Zama , Kenichi Ohga
- Applicant Address: JP Tokyo
- Assignee: Furukawa Electric Co., Ltd.
- Current Assignee: Furukawa Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Kubotera & Associates, LLC
- Priority: JP2007-071143 20070319; JP2008-066175 20080314
- Main IPC: B32B3/10
- IPC: B32B3/10

Abstract:
A method for manufacturing a metal clad laminate having a film and a metal layer formed of a foundation layer and an upper layer includes the steps of forming the foundation layer on at least a part of a surface of the film by plating to obtain a first laminate; forming the upper layer on the first laminate by plating to obtain a second laminate; and heating the second laminate to obtain the metal clad laminate. Further, the film is a flexible thermoplastic polymer film, the foundation layer is formed of a nickel alloy, the upper layer is formed of copper, at least one of the foundation layer and the upper layer has a compression stress before the step of heating the second laminate, and the metal clad laminate shrinks in a planar direction of the film during the step of heating the second laminate.
Public/Granted literature
- US20100047517A1 METAL CLAD LAMINATE AND METHOD FOR MANUFACTURING METAL CLAD LAMINATE Public/Granted day:2010-02-25
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