Invention Grant
- Patent Title: Reduced thermal conductivity thermal barrier coating by electron beam-physical vapor deposition process
- Patent Title (中): 通过电子束物理气相沉积工艺降低热导率热障涂层
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Application No.: US12415106Application Date: 2009-03-31
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Publication No.: US08147928B2Publication Date: 2012-04-03
- Inventor: Nicolas E. Ulion
- Applicant: Nicolas E. Ulion
- Applicant Address: US CT Hartford
- Assignee: United Technologies Coporation
- Current Assignee: United Technologies Coporation
- Current Assignee Address: US CT Hartford
- Agency: Bachman & LaPointe, P.C.
- Main IPC: C23C14/30
- IPC: C23C14/30
Abstract:
A method for reducing thermal conductivity in thermal barrier coatings broadly includes the steps of depositing a mixture containing a ceramic matrix and a metallic dispersant capable of forming a metal oxide upon a substrate to form one or more layers; and heating the layers at a temperature and for a time sufficient to oxidize the metallic dispersant and form one or more layers of a thermal barrier coating.
Public/Granted literature
- US20090305866A1 Reduced Thermal Conductivity Thermal Barrier Coating by Electron Beam-Physical Vapor Deposition Process Public/Granted day:2009-12-10
Information query
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