Invention Grant
- Patent Title: Conductive polymer composites
- Patent Title (中): 导电聚合物复合材料
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Application No.: US10823311Application Date: 2004-04-13
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Publication No.: US08147962B2Publication Date: 2012-04-03
- Inventor: Che-Hsiung Hsu , Christopher P. Junk , Sunghan Kim , Daniel David Lecloux , Ralph Birchard Lloyd , Shiva Prakash
- Applicant: Che-Hsiung Hsu , Christopher P. Junk , Sunghan Kim , Daniel David Lecloux , Ralph Birchard Lloyd , Shiva Prakash
- Applicant Address: US DE Wilmington
- Assignee: E. I. du Pont de Nemours and Company
- Current Assignee: E. I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: B32B9/00
- IPC: B32B9/00 ; H01L51/00 ; H01L51/54
Abstract:
The invention relates to conductive polymer composites comprising a first layer comprising at least one electrically doped conductive polymer and a second layer comprising at least one material selected from a colloid-forming polymeric acid, a salt of a colloid-forming polymeric acid, a non-polymeric fluorinated organic acid, and a salt of a non-polymeric fluorinated organic acid.
Public/Granted literature
- US20050227081A1 Conductive polymer composites Public/Granted day:2005-10-13
Information query
