Invention Grant
- Patent Title: Sealed glass package
- Patent Title (中): 密封玻璃包装
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Application No.: US13172015Application Date: 2011-06-29
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Publication No.: US08147976B2Publication Date: 2012-04-03
- Inventor: Heather Debra Boek , John W Botelho , Jason Arthur Howles
- Applicant: Heather Debra Boek , John W Botelho , Jason Arthur Howles
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Kevin M. Able
- Main IPC: B32B17/00
- IPC: B32B17/00 ; E06B3/00 ; H01J1/62
Abstract:
A method is described herein for sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container.
Public/Granted literature
- US20110256407A1 METHOD FOR SINTERING A FRIT TO A GLASS PLATE Public/Granted day:2011-10-20
Information query
