Invention Grant
- Patent Title: Thermoplastic resin composition and composite molded product
- Patent Title (中): 热塑性树脂组合物和复合成型品
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Application No.: US12227064Application Date: 2007-05-08
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Publication No.: US08147977B2Publication Date: 2012-04-03
- Inventor: Kazuo Nishimoto , Katsuya Furushige , Koji Hirata , Yoshito Nagao
- Applicant: Kazuo Nishimoto , Katsuya Furushige , Koji Hirata , Yoshito Nagao
- Applicant Address: JP Tokyo
- Assignee: UMG ABS, Ltd.
- Current Assignee: UMG ABS, Ltd.
- Current Assignee Address: JP Tokyo
- Agent Manabu Kanesaka
- Priority: JP2006-140493 20060519
- International Application: PCT/JP2007/059484 WO 20070508
- International Announcement: WO2007/135852 WO 20071129
- Main IPC: B32B27/08
- IPC: B32B27/08 ; C08L33/18 ; C08L33/04 ; C08L31/00 ; C08L35/02 ; C08L83/00 ; C08G63/48
Abstract:
A thermoplastic resin composition that includes 100 parts by mass of a first vinyl (co)polymer (I) that is produced by (co)polymerization of at least one monomer component selected from the group consisting of aromatic vinyl compounds, vinyl cyanide compounds, and other vinyl monomers copolymerizable with these compounds, and 1 to 100 parts by mass of a vinyl copolymer (II) that is produced by copolymerization of a vinyl cyanide compound and another vinyl monomer copolymerizable with the vinyl cyanide compound and in which the content of the vinyl cyanide compound component in an acetone soluble fraction of the copolymer ranges from 0.1% to 15% by mass.
Public/Granted literature
- US20090110943A1 Thermoplastic Resin Composition and Composite Molded Product Public/Granted day:2009-04-30
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