Invention Grant
- Patent Title: Film-covered electrical device packaging system
- Patent Title (中): 薄膜覆盖电气设备包装系统
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Application No.: US12090217Application Date: 2006-10-10
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Publication No.: US08147997B2Publication Date: 2012-04-03
- Inventor: Tadashi Shimamori
- Applicant: Tadashi Shimamori
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: NEC Corporation,Fuji Jukogyo Kabushiki Kaisha
- Current Assignee: NEC Corporation,Fuji Jukogyo Kabushiki Kaisha
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-300221 20051014
- International Application: PCT/JP2006/320173 WO 20061010
- International Announcement: WO2007/043510 WO 20070419
- Main IPC: H01M2/10
- IPC: H01M2/10

Abstract:
A film-covered electrical device packaging system of the present invention includes frame member (10) which holds film covered battery (1) by an outer periphery portion of film covered battery (1) and which has a portion thicker than the thickness of power generation element (2), and in which waste gas channel (10i) is formed in a position corresponding to gas discharger (8), and first pressure plate (20) which sandwiches frame member (10), in which penetrating portion (22) is formed in a position corresponding to waste gas channel (10i), and in which gas guide groove (21) communicating from through holes (22) to sidewall face (24) is formed.
Public/Granted literature
- US20090286138A1 FILM-COVERED ELECTRICAL DEVICE PACKAGING SYSTEM Public/Granted day:2009-11-19
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