Invention Grant
- Patent Title: Process for producing a contact area of an electronic component
- Patent Title (中): 一种电子部件的接触区域的制造方法
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Application No.: US12880198Application Date: 2010-09-13
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Publication No.: US08148195B2Publication Date: 2012-04-03
- Inventor: Axel Metz , Stefan Bagus , Stefan Dauwe , Tobias Droste , Peter Roth , Andreas Teppe
- Applicant: Axel Metz , Stefan Bagus , Stefan Dauwe , Tobias Droste , Peter Roth , Andreas Teppe
- Applicant Address: DE Mainz
- Assignee: Schott Solar AG
- Current Assignee: Schott Solar AG
- Current Assignee Address: DE Mainz
- Agency: Dennison, Schultz & MacDonald
- Priority: DE102009044038 20090917
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A process for forming at least one local contact area of a substrate of an electrical component for contacting the contact area with a connector, in which the substrate, on the contact side, is provided with a sintered porous metal layer. To make available a mechanically durable, electrically faultless solderable contact area, it is proposed that the porous layer be compacted and/or removed in the contact area to be formed.
Public/Granted literature
- US20110065231A1 PROCESS FOR PRODUCING A CONTACT AREA OF AN ELECTRONIC COMPONENT Public/Granted day:2011-03-17
Information query
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