Invention Grant
- Patent Title: Integrated circuit package system with leaded package and method for manufacturing thereof
- Patent Title (中): 具有引线封装的集成电路封装系统及其制造方法
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Application No.: US12822954Application Date: 2010-06-24
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Publication No.: US08148208B2Publication Date: 2012-04-03
- Inventor: Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Henry Descalzo Bathan , Lionel Chien Hui Tay
- Applicant: Zigmund Ramirez Camacho , Jairus Legaspi Pisigan , Henry Descalzo Bathan , Lionel Chien Hui Tay
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/02 ; H01L23/52 ; H01L23/28
Abstract:
A method for manufacturing an integrated circuit package system includes: providing a frame; attaching a leaded package having leads adjacent the frame wherein the leads extend towards a side opposite the frame; and applying a package encapsulant over the leaded package having the leads partially exposed opposite the frame.
Public/Granted literature
- US20100264525A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADED PACKAGE AND METHOD FOR MANUFACTURING THEREOF Public/Granted day:2010-10-21
Information query
IPC分类:
