Invention Grant
US08148227B2 Method for providing a self-aligned conductive structure 有权
提供自对准导电结构的方法

Method for providing a self-aligned conductive structure
Abstract:
An embodiment according to the present invention comprises a method for providing a self-aligned conductive structure comprising providing a first structure on a surface, wherein the first structure comprises a first and a second layer, and providing an intermediate structure on the surface, wherein the intermediate structure at least partially abuts the first structure laterally at a first lateral edge of the first structure. The method further comprises removing at least a part of the second layer, the part being adjacent to the first lateral edge, and providing the conductive structure such that the conductive structure replaces at least the removed part of the second layer and abuts the first lateral edge.
Public/Granted literature
Information query
Patent Agency Ranking
0/0