Invention Grant
- Patent Title: Two-step hardmask fabrication methodology for silicon waveguides
- Patent Title (中): 硅波导的两步硬掩模制造方法
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Application No.: US12201807Application Date: 2008-08-29
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Publication No.: US08148265B2Publication Date: 2012-04-03
- Inventor: Daniel N. Carothers , Craig M. Hill , Andrew T. Pomerene
- Applicant: Daniel N. Carothers , Craig M. Hill , Andrew T. Pomerene
- Applicant Address: US NH Nashua
- Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee Address: US NH Nashua
- Agency: Finch & Maloney PLLC
- Agent Neil F. Maloney
- Main IPC: H01L21/302
- IPC: H01L21/302

Abstract:
Techniques are disclosed for efficiently fabricating semiconductors including waveguide structures. In particular, a two-step hardmask technology is provided that enables a stable etch base within semiconductor processing environments, such as the CMOS fabrication environment. The process is two-step in that there is deposition of a two-layer hardmask, followed by a first photolithographic pattern, followed by a first silicon etch, then a second photolithographic pattern, and then a second silicon etch. The process can be used, for example, to form a waveguide structure having both ridge and channel configurations, or a waveguide (ridge and/or channel) and a salicide heater structure, all achieved using the same hardmask. The second photolithographic pattern allows for the formation of the lower electrical contacts to the waveguides (or other structures) without a complicated rework of the hardmask.
Public/Granted literature
- US20100055906A1 TWO-STEP HARDMASK FABRICATION METHODOLOGY FOR SILICON WAVEGUIDES Public/Granted day:2010-03-04
Information query
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